4. Coating processes
  5. Immersion or partial immersion

Peter Elenius

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Chip scale package using large ductile solder balls

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Forming partial-depth features in polymer film

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
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Method for forming chip scale package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method for forming chip scale package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Non-contact fluid applicator apparatus and method

Coating processes – Immersion or partial immersion
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Profile ID: LFUS-PAI-P-930383

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