4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Incoherent light emitter structure
  6. With housing or contact structure

FlipChip International LLC

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Build-up structures with multi-angle vias for Chip to Chip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Build-up structures with multi-angle vias for chip to chip...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Forming partial-depth features in polymer film

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
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Solder bar for high power flip chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Wafer-level moat structures

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
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Profile ID: LFUS-PAI-P-2980178

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