Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-05-31
2011-05-31
Thomas, Tom (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE33001
Reexamination Certificate
active
07951646
ABSTRACT:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
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Moxham Stephen F.
Reeder Willam J.
Rumsey Brad D.
Stoddard Dana A.
Tandy Patrick W.
Lerner David Littenberg Krumholz & Mentlik LLP
Round Rock Research, LLC
Thomas Tom
Trinh Hoa B
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