4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Brad D. Rumsey

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Apparatus and method for reducing interposer compression...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Apparatus and method for reducing interposer compression...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Apparatus for reduced flash encapsulation of microelectronic...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
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Controlling packaging encapsulant leakage

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Controlling packaging encapsulant leakage

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2063285

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