Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-07-05
2005-07-05
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000, C257S207000, C257S211000, C257S210000, C257S700000, C257S696000, C257S697000, C257S668000, C257S784000, C257S786000, C257S698000, C257S693000, C361S777000, C361S760000, C361S790000, C361S767000, C174S250000, C174S261000, C174S260000, C439S070000, C439S066000, C439S075000, C228S180100, C333S001000
Reexamination Certificate
active
06914326
ABSTRACT:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
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Moxham Stephen F.
Reeder Willam J.
Rumsey Brad D.
Stoddard Dana A.
Tandy Patrick W.
Williams Alexander Oscar
Yoder Fletcher
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