Soft error resistant semiconductor device

Details Soft error resistant semiconductor device Soft error resistant semiconductor device

2005-05-17

2005-05-17

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S779000, C257S780000

Reexamination Certificate

active

06894390

ABSTRACT:
A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for stopping the alpha particles are compatible with standard back-end processing and do not degrade adhesion of the solder bump to the remaining substrate. Moreover, a low electrical resistance is maintained and heat dissipation may be improved.

REFERENCES:
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patent: 6287893 (2001-09-01), Elenius et al.
patent: 20020074656 (2002-06-01), Ujiie et al.
patent: 20030119300 (2003-06-01), Chiu et al.
patent: 198 42 441 (1999-09-01), None
patent: 100 56 869 (2002-06-01), None
patent: 11111885 (1999-04-01), None

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