Smart conditioner rinse station

Details Smart conditioner rinse station Smart conditioner rinse station

2007-05-01

2007-05-01

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S072000

Reexamination Certificate

active

11273766

ABSTRACT:
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

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patent: 1 270 148 (2003-01-01), None
PCT Partial International Search Report for International Application No. PCT/US2006/000736; International Filing Date Oct. 1, 2006.
PCT Inernational Written Opinion for PCT/US2006/000736, Dated Sep. 19, 2006.

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