Slotted lead for a semiconductor device

Details Slotted lead for a semiconductor device Slotted lead for a semiconductor device

1997-02-05

2000-03-21

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257669, 257674, H01L 23495, H01L 2348, H01L 2352

Patent

active

060406232

ABSTRACT:
A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

REFERENCES:
patent: 4089041 (1978-05-01), Lockard
patent: 4477970 (1984-10-01), Alexander et al.
patent: 4642419 (1987-02-01), Meddles
patent: 4867715 (1989-09-01), Roth et al.
patent: 4987474 (1991-01-01), Yasuhara et al.
patent: 5180097 (1993-01-01), Zenshi
patent: 5270492 (1993-12-01), Fukui
IBM TDB Short Free-Foot Design for Fine Pitch SMT Component, vol. 32, No. 5B, Oct. 1989, pp. 53-54.

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