Single wafer cleaning method to reduce particle defects on a...

Details Single wafer cleaning method to reduce particle defects on a... Single wafer cleaning method to reduce particle defects on a...

2008-03-11

2008-03-11

Deo, Duy-Vu N (Department: 1765)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C438S745000, C438S747000

Reexamination Certificate

active

11497182

ABSTRACT:
Methods of preventing air-liquid interfaces on the surface of a wafer in order to prevent the formation of particle defects on a wafer are presented. The air-liquid interfaces may be prevented by covering the entire surface of the wafer with liquid at all times during a cleaning process while the surface of the wafer is hydrophobic. Methods of preventing the formation of silica agglomerates in a liquid during a pH transition from an alkaline pH to a neutral pH are also presented, including minimizing the turbulence in the liquid solution and reducing the temperature of the liquid solution during the transition.

REFERENCES:
patent: 6982006 (2006-01-01), Boyers et al.
patent: 7163018 (2007-01-01), Verhaverbeke et al.
patent: 2001/0047810 (2001-12-01), Farber et al.
patent: 2002/0157686 (2002-10-01), Kenny et al.
patent: 2003/0051742 (2003-03-01), Boyers
patent: 2004/0029395 (2004-02-01), Zhang et al.

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