Single wafer cleaning method to reduce particle defects on a...

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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C438S745000

Reexamination Certificate

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10736007

ABSTRACT:
Methods of preventing air-liquid interfaces on the surface of a wafer in order to prevent the formation of particle defects on a wafer are presented. The air-liquid interfaces may be prevented by covering the entire surface of the wafer with liquid at all times during a cleaning process while the surface of the wafer is hydrophobic. Methods of preventing the formation of silica agglomerates in a liquid during a pH transition from an alkaline pH to a neutral pH are also presented, including minimizing the turbulence in the liquid solution and reducing the temperature of the liquid solution during the transition.

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Iler, Ralph K., The Colloid Chemistry Of Silica And Silicates, © 1955 By Cornell University, Cornell University Press, London: Geoffrey Cumberlege, Oxford University Press, First published 1955, Printed in the United States Of America By The George Banta Publishing Company, Menasha, Wisconsin, pp. 44-48.

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