Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2007-01-16
2007-01-16
Deo, Duy-Vu N (Department: 1765)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C438S745000
Reexamination Certificate
active
10736007
ABSTRACT:
Methods of preventing air-liquid interfaces on the surface of a wafer in order to prevent the formation of particle defects on a wafer are presented. The air-liquid interfaces may be prevented by covering the entire surface of the wafer with liquid at all times during a cleaning process while the surface of the wafer is hydrophobic. Methods of preventing the formation of silica agglomerates in a liquid during a pH transition from an alkaline pH to a neutral pH are also presented, including minimizing the turbulence in the liquid solution and reducing the temperature of the liquid solution during the transition.
REFERENCES:
patent: 5466389 (1995-11-01), Ilardi et al.
patent: 5853491 (1998-12-01), Schulz
patent: 6468362 (2002-10-01), Chen et al.
patent: 2003/0051742 (2003-03-01), Boyers
patent: 2004/0029388 (2004-02-01), Verhaverbeke et al.
patent: 2004/0029395 (2004-02-01), Zhang et al.
patent: 2004/0221877 (2004-11-01), Bergman
Iler, Ralph K., The Colloid Chemistry Of Silica And Silicates, © 1955 By Cornell University, Cornell University Press, London: Geoffrey Cumberlege, Oxford University Press, First published 1955, Printed in the United States Of America By The George Banta Publishing Company, Menasha, Wisconsin, pp. 44-48.
Beaudry Christopher Laurent
Verhaverbeke Steven
Applied Materials Inc.
Blakely & Sokoloff, Taylor & Zafman
Deo Duy-Vu N
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