4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

EPIC Technologies, Inc.

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Abnormal tire condition warning system

Communications: electrical – Land vehicle alarms or indicators – Internal alarm or indicator responsive to a condition of the...
Patent

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Compliant, solderable input/output bump structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Data logging tire monitor with condition predictive capabilities

Communications: electrical – Land vehicle alarms or indicators – Internal alarm or indicator responsive to a condition of the...
Patent

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Electroless metal connection structures and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated circuit structures and methods employing a low...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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