Single chamber sputtering assembly

Details Single chamber sputtering assembly Single chamber sputtering assembly

1996-07-24

1997-12-02

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429809, 20429826, C23C 1434, C23C 1435

Patent

active

056931999

ABSTRACT:
A sputtering assembly for use in forming sputter deposited layers on a substrate is described. The assembly includes a pair of confronting sputtering targets for depositing sputtered layers onto the substrate and a movably mounted heating means for heating the substrate. A method of using the assembly is also disclosed.

REFERENCES:
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patent: 4517070 (1985-05-01), Kisner
patent: 4880514 (1989-11-01), Scott et al.
patent: 5554224 (1996-09-01), Foltyn
Cord, B., et al., "Sputtering of High Coercivity/Low Noise CoCrTa Bilayered Hard Disks in a Manufacturing System," IEEE Trans. Magn. 29(6): 3694-3696 (1993).
Judy, J.H., "Experimental Studies of Noise in Isotropic Longitudinal CoCrTa/Cr Thin Film Media," IEEE Trans. Magn. 29(1):209-214 (1993).
Shen, Y., et al., "Effects of Substrate Temperature on Magnetic Properties of CoCrTa/Cr Films," IEEE Trans. Magn. 28:326-328 (1992).
Teng, E., and Eltoukhy, A., "Flash Chromium Interlayer for High Performance Disks with Superior Noise and Coercivity Squareness," IEEE Trans. Magn. 29(6):3679-3681 (1993).

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