Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-03-27
2000-11-21
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438111, 438118, 438382, 438612, 438617, 438618, 438650, 438686, 438687, 438688, 257741, 257690, H01L 2150, H01L 2120, H01L 2144
Patent
active
061502626
ABSTRACT:
A wire and method of making the wire for use in conjunction with the fabrication of semiconductor devices which consists essentially of forming one of an alloy or composite of from a finite amount approaching zero to about 50 percent by weight of at least one of carbon and the metals taken from the class consisting of platinum, silver and electrically conductive base metals and the rest gold. A wire is then formed from the alloy or composite. The noble metal alloyed with gold is preferably silver and the base metals that can be used are preferably copper or aluminum.
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Bischocho Vivian R.
Go Bernard A.
Brady III Wade James
Nguyen Ha Tran
Niebling John F.
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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