Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps
Reexamination Certificate
2005-11-22
2005-11-22
Norton, Nadine (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Having liquid and vapor etching steps
C438S706000, C438S715000, C438S723000, C438S743000, C438S744000
Reexamination Certificate
active
06967167
ABSTRACT:
A method for removing silicon dioxide residuals is disclosed. The method includes reacting a portion of a silicon dioxide layer (i.e., oxide) to form a reaction product layer, removing the reaction product layer and annealing in an environment to remove oxide residuals. The method finds application in a variety of semiconductor fabrication processes including, for example, fabrication of a vertical HBT or silicon-to-silicon interface without an oxide interface.
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Geiss Peter J.
Joseph Alvin J.
Liu Xuefeng
Nakos James S.
Quinlivan James J.
Canale Anthony J.
Hoffman Warnick & D'Alessandro LLC
International Business Machines - Corporation
Norton Nadine
Tran Binh X.
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