Silicon carbide semiconductor device and method for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S243000, C257SE21054, C257SE21115

Reexamination Certificate

active

11268612

ABSTRACT:
A method for manufacturing a silicon carbide semiconductor device includes the steps of: preparing a semiconductor substrate including a silicon carbide substrate and first to third semiconductor layers; forming a trench in a cell region of the semiconductor substrate; forming a fourth semiconductor layer in the trench; forming an oxide film in the trench such that a part of the fourth semiconductor layer on a sidewall of the trench is thermally oxidized; forming a gate electrode on the oxide film in the trench; forming a first electrode electrically connecting to the third semiconductor layer; and forming a first electrode electrically connecting to the silicon carbide substrate.

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Chung et al., “Effect of nitric oxide annealing on the interface trap densities near the band edges in the 4H polytype of silicon carbide.”Applied Physics Letters, vol. 76, No. 13, pp. 1713-1715, Mar. 2000.
Xu et al., “Improved Performance and Reliability of N20-Grown Oxy-nitride on 6H-SiC.”IEEE Electron Device Letters, vol. 21, No. 6, pp. 298-300, Jun. 2000.
Um et al., “MOS Interface Research.”MOS Interface Research at PurdueJan. 20, 2001: pp. 1-6. Purdue WBG. Nov. 22, 2005 http://www.ecn.purdue.edu/WBG/Basic—Measurements/MOSInterface/Index.html.

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