Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-02-08
2011-10-18
Walke, Amanda C. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S005000, C430S273100, C430S312000, C430S322000, C430S325000, C430S330000, C430S331000, C430S394000, C430S913000, C430S927000
Reexamination Certificate
active
08039195
ABSTRACT:
A method of lithography patterning includes forming a resist pattern on a substrate, the resist pattern including at least one desired opening and at least one padding opening therein on the substrate; forming a patterned photosensitive material layer on the resist pattern and the substrate, wherein the patterned photosensitive material layer covers the padding opening of the resist pattern; and applying a resolution enhancement lithography by assist of chemical shrink (RELACS) process to the desired opening of the resist pattern.
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Chinese Patent Office, Office Action mailed Apr. 8, 2010, Application No. 200910005762.X, 4 pages.
Shih Jen-Chieh
Yeh Hsiao-Wei
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
Walke Amanda C.
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