Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2008-06-17
2008-06-17
Doan, Theresa T. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S111000
Reexamination Certificate
active
07387916
ABSTRACT:
An integrated circuit package lead frame, comprising a plurality of leads and a spine electrically connected to said plurality of leads, said spine comprising indentations between a pair of said leads. The indentations prevent the pair of leads from becoming electrically connected to each other after a singulation process.
REFERENCES:
patent: 4722060 (1988-01-01), Quinn et al.
patent: 5717246 (1998-02-01), Brooks et al.
patent: 6372412 (2002-04-01), Hakey et al.
patent: 6713322 (2004-03-01), Lee
Kamino Teiji
Koudoh Takhiko
Yajima Kiyoshi
Brady III Wade James
Doan Theresa T.
Nguyen Dilinh
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Sharp corner lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sharp corner lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sharp corner lead frame will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2815404