Shadow frame with cross beam for semiconductor equipment

Coating apparatus – Gas or vapor deposition – Having means to expose a portion of a substrate to coating...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S345100

Reexamination Certificate

active

08002896

ABSTRACT:
A shadow frame and framing system for semiconductor fabrication equipment comprising a rectangular frame having four edges, the edges forming an interior lip with a top surface and an bottom engagement surface; and a cross beam disposed between at least two edges of the frame, the cross beam having a top surface and a bottom engagement surface, the engagement surface of the cross beam configured to be flush with the engagement surface of the lip; wherein one or more of the engagement surfaces are configured to cover metal interconnect bonding areas on a carrier disposed below the frame. The shadow frame is particularly useful in plasma enhanced chemical vapor deposition (PECVD) applications used to make active matrix liquid crystal displays (AMLCDs) and solar cells.

REFERENCES:
patent: 3608518 (1971-09-01), Poole
patent: 3887421 (1975-06-01), Hudson et al.
patent: 4194930 (1980-03-01), Tanaka et al.
patent: 4443930 (1984-04-01), Hwang et al.
patent: 5093151 (1992-03-01), van den Berg et al.
patent: 5216806 (1993-06-01), Lam
patent: 5332443 (1994-07-01), Chew et al.
patent: 5380566 (1995-01-01), Robertson et al.
patent: 5525817 (1996-06-01), Hill et al.
patent: 5567289 (1996-10-01), Taylor et al.
patent: 5573596 (1996-11-01), Yin
patent: 5611865 (1997-03-01), White et al.
patent: 5720818 (1998-02-01), Donde et al.
patent: 5863396 (1999-01-01), Flanigan
patent: 5885751 (1999-03-01), Weidman et al.
patent: 5895549 (1999-04-01), Goto et al.
patent: 5942042 (1999-08-01), Gogh
patent: 5976989 (1999-11-01), Ishiguro
patent: 6074488 (2000-06-01), Roderick et al.
patent: 6270859 (2001-08-01), Zhao et al.
patent: 6355108 (2002-03-01), Won et al.
patent: 6365495 (2002-04-01), Wang et al.
patent: 6406925 (2002-06-01), Athavale et al.
patent: 6494958 (2002-12-01), Shamouilian et al.
patent: 6499427 (2002-12-01), Yamazaki et al.
patent: 6528751 (2003-03-01), Hoffman et al.
patent: 6554954 (2003-04-01), Ma et al.
patent: 6960263 (2005-11-01), Tanaka et al.
patent: 7501161 (2009-03-01), Hou et al.
patent: 2003/0106646 (2003-06-01), Ma et al.
patent: 2003/0205327 (2003-11-01), Howald et al.
patent: 2005/0120960 (2005-06-01), Chen
patent: 59-076559 (1984-05-01), None
patent: 62-204322 (1987-12-01), None
patent: 06-340975 (1994-12-01), None
patent: 07-197248 (1995-08-01), None
patent: 08-092739 (1996-04-01), None
patent: 08-293539 (1996-11-01), None
patent: 09-171113 (1997-06-01), None
patent: 10-280154 (1998-10-01), None
patent: 10-298738 (1998-11-01), None
patent: 2001-196309 (2001-07-01), None
patent: 2001-329366 (2001-11-01), None
patent: 2003-100713 (2003-04-01), None
patent: 2003-100851 (2003-04-01), None
patent: 2001-0012878 (2001-02-01), None
patent: WO 98/53482 (1998-11-01), None
J.F. Shackelford, Introduction to Materials Science for Engineers; 4rd Ed. 1992, Macmillan Publishing Co., p. 757.
Korean Application No. 10-2003-0026368, now Korean Patent #648322 OA dated May 18, 2006.
Preliminary Amendment of U.S. Appl. No. 10/136,249, filed Jul. 8, 2002.
Office Action of U.S. Appl. No. 10/136,249 mailed Jul. 2, 2003.
Jan. 2, 2004 Response to Office Action of U.S. Appl. No. 10/136,249 mailed Jul. 2, 2003.
Final Office Action of U.S. Appl. No. 10/136,249 mailed Mar. 24, 2004.
Jun. 24, 2004 Response to Final Office Action of U.S. Appl. No. 10/136,249 mailed Mar. 24, 2004.
Advisory Action of U.S. Appl. No. 10/136,249 issued Jul. 19, 2004.
Nov. 29, 2004 Appeal Brief of U.S. Appl. No. 10/136,249.
Notice of Defective Appeal Brief of U.S. Appl. No. 10/136,249 issued Feb. 3, 2005.
Mar. 3, 2005 Appeal Brief of U.S. Appl. No. 10/136,249.
Notice of Allowance of U.S. Appl. No. 10/136,249 mailed Jun. 3, 2005.
Office Action of U.S. Appl. No. 10/858,267 mailed Jul. 27, 2006.
Dec. 27, 2006 Response to Office Action of U.S. Appl. No. 10/858,267 mailed Jul. 27, 2006.
Notice of Non-Compliant Amendment of U.S. Appl. No. 10/858,267 mailed Jan. 18, 2007.
Feb. 7, 2007 Response to Notice of Non-Compliant Amendment of U.S. Appl. No. 10/858,267 mailed Jan. 18, 2007.
Notice of Non-Compliant Amendment of U.S. Appl. No. 10/858,267 mailed May 1, 2007.
May 17, 2007 Response to Notice of Non-Compliant Amendment of U.S. Appl. No. 10/858,267 mailed May 1, 2007.
Final Office Action of U.S. Appl. No. 10/858,267 mailed Aug. 8, 2007.
Dec. 5, 2007 Response to Final Office Action of U.S. Appl. No. 10/858,267 mailed Aug. 8, 2007.
Advisory Action of U.S. Appl. No. 10/858,267 issued Dec. 17, 2007.
Jan. 8, 2008 Amendment filed with RCE of U.S. Appl. No. 10/858,267.
Office Action of U.S. Appl. No. 10/858,267 mailed Mar. 17, 2008.
Jul. 17, 2008 Response to Office Action of U.S. Appl. No. 10/858,267 mailed Mar. 17, 2008.
Notice of allowance of of U.S. Appl. No. 10/858,267 mailed Nov. 18, 2008.
Office Action of Japanese Application No. 2003-122713 mailed Apr. 7, 2009.
Restriction Requirement of U.S. Patent Application No. 10/858,267 (86581Y02) mailed Apr. 3, 2006.
May 3, 2006 Response to Restriction Requirement of U.S. Patent Application No. 10/858,267 (8658/Y02) mailed 4-32006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Shadow frame with cross beam for semiconductor equipment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shadow frame with cross beam for semiconductor equipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shadow frame with cross beam for semiconductor equipment will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2742207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.