Shadow clamp

Details Shadow clamp Shadow clamp

1993-07-30

1996-07-09

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 427569, 414941, 269254R, 269903, 118503, 118728, H05H 100, B25B 500

Patent

active

055341101

ABSTRACT:
A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

REFERENCES:
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4978412 (1990-12-01), Aoki et al.
patent: 5013400 (1991-05-01), Kurasaki et al.
patent: 5203981 (1993-04-01), Akazawa
patent: 5262029 (1993-11-01), Erskine et al.
patent: 5268067 (1993-12-01), Dostalik et al.

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