Sensor module

Details Sensor module Sensor module

2008-01-29

2008-01-29

Le, Thanh-Tam (Department: 2839)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S784000

Reexamination Certificate

active

07323766

ABSTRACT:
A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

REFERENCES:
patent: 5862248 (1999-01-01), Salatino et al.
patent: 6670221 (2003-12-01), Sakoda et al.
patent: 6953891 (2005-10-01), Bolken et al.
patent: 6983537 (2006-01-01), Park

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