Semiconductor wafers having asymmetric edge profiles that...

Details Semiconductor wafers having asymmetric edge profiles that... Semiconductor wafers having asymmetric edge profiles that...

2007-08-21

2007-08-21

McNeil, Jennifer (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S446000

Reexamination Certificate

active

10601475

ABSTRACT:
Semiconductor wafers utilize asymmetric edge profiles (EP) to facilitate higher yield semiconductor device processing. These edge profiles are configured to reduce the volume of thin film residues that may form on a top surface of a semiconductor wafer at locations adjacent a peripheral edge thereof. These edges profiles are also configured to inhibit redeposition of residue particulates on the top surfaces of the wafers during semiconductor processing steps. Such steps may include surface cleaning and rinsing steps that may include passing a cleaning or rinsing solution across a wafer or batch of wafers that are held by a cartridge and submerged in the solution.

REFERENCES:
patent: 4630093 (1986-12-01), Yamaguchi et al.
patent: 5021862 (1991-06-01), Ogino
patent: 5045505 (1991-09-01), Kimura
patent: 5110764 (1992-05-01), Ogino
patent: 5182233 (1993-01-01), Inoue
patent: 5225235 (1993-07-01), Yoshiharu et al.
patent: 5230747 (1993-07-01), Maejima et al.
patent: 5279992 (1994-01-01), Maejima et al.
patent: 5389579 (1995-02-01), Wells
patent: 5668062 (1997-09-01), Hyun et al.
patent: 5751055 (1998-05-01), Maruyama et al.
patent: 5882539 (1999-03-01), Hasegawa et al.
patent: 5914053 (1999-06-01), Masamura et al.
patent: 101 31 246 (2002-03-01), None
patent: 03-177023 (1991-08-01), None
patent: 06314676 (1994-11-01), None
patent: 2001-030567 (2001-04-01), None
Office Action, German Application No. 103 37 757.3-33, Oct. 7, 2005), printed.
Notice to Submit Response, Korean Application No. 10-2003-0038320, Feb. 25, 2005 (+ translation).

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