Semiconductor wafer treatment method

Details Semiconductor wafer treatment method Semiconductor wafer treatment method

2006-03-28

2008-12-23

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C257SE21599, C438S015000

Reexamination Certificate

active

07468309

ABSTRACT:
A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser beams are applied to the adhesive tape based on such detection.

REFERENCES:
patent: 7390681 (2008-06-01), Tristan
patent: 2002-118081 (2002-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor wafer treatment method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer treatment method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer treatment method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4045232