Semiconductor wafer manufacturing methods employing cleaning...

Details Semiconductor wafer manufacturing methods employing cleaning... Semiconductor wafer manufacturing methods employing cleaning...

2005-08-23

2005-08-23

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C438S906000

Reexamination Certificate

active

06933157

ABSTRACT:
A method of manufacturing a semiconductor wafer including cleaning a surface of the wafer during a first time period and forming a layer over the surface during a second time period. The first time period includes a cleaning delay period prior to a cleaning portion of the first time period, the cleaning delay period configured such that an end time of the first time period substantially coincides with a start time of the second time period.

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