Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2006-09-05
2006-09-05
Stafira, Michael P. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237500
Reexamination Certificate
active
07102743
ABSTRACT:
A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.
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“VLSI Manufacturing Technique” dated Oct. 10, 1998, ISBN:957-584-327-4, pp. 241-242.
Hashimoto Katsuyuki
Ikeno Yasunori
Kitahara Yasutoshi
Kurata Shunsuke
Tsuji Haruyuki
Frishauf Holtz Goodman & Chick P.C.
Olympus Corporation
Stafira Michael P.
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