Semiconductor wafer having identification indication

Details Semiconductor wafer having identification indication Semiconductor wafer having identification indication

2003-10-10

2008-05-13

Pham, Hoai v (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S618000, C257SE23179

Reexamination Certificate

active

07372150

ABSTRACT:
A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.

REFERENCES:
patent: 101 31 246 (2005-02-01), None
patent: 59023512 (1984-02-01), None
patent: 10-256105 (1998-09-01), None
patent: 000057827 (2000-09-01), None
English Language Abstract of Japan Publication No: 10-256105.
English Language Abstract of Korean Publication No: 000057827 A.

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