Semiconductor surface measurement system and method

Details Semiconductor surface measurement system and method Semiconductor surface measurement system and method

1997-12-12

1999-09-21

Hantis, K P

Optics: measuring and testing

By polarized light examination

Of surface reflection

G01J 400

Patent

active

059561483

ABSTRACT:
A semiconductor surface measurement system (100) is disclosed. In this system, a plurality of wafers (106), each having an exposed surface, are held by a wafer positioning system (104), which sequentially moves the wafers into a measurement zone. A wafer position detection system (124) detects the position of a selected wafer, and generates an output signal indicating the position of the selected wafer. A surface measurement apparatus (114 through 121, 130 through 142) measures a property of the exposed surface of the selected wafer (106) in response to the output signal of the wafer position detection system (124) when the selected wafer is in the measurement zone. The disclosed surface measurement system (100)may be used to gather real-time data concerning surface properties such as composition, roughness and epilayer thickness during multi-wafer semiconductor processing.

REFERENCES:
patent: 5408322 (1995-04-01), Hsu et al.
patent: 5501637 (1996-03-01), Duncan et al.
patent: 5513948 (1996-05-01), Bacchi et al.
patent: 5556465 (1996-09-01), Levola

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