Semiconductor substrate thinning method for manufacturing...

Details Semiconductor substrate thinning method for manufacturing... Semiconductor substrate thinning method for manufacturing...

2005-05-09

2008-05-20

Lee, Hsien Ming (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S411000, C257S734000, C257S735000, C257S736000

Reexamination Certificate

active

07375032

ABSTRACT:
In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the substrate thinning process. Concurrently, the risk of substrate breakage is reduced compared to the prior art process since the number of process steps, requiring handling of thinned substrates, is reduced.

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