Semiconductor substrate, method for fabricating the same,...

Details Semiconductor substrate, method for fabricating the same,... Semiconductor substrate, method for fabricating the same,...

2008-07-01

2008-07-01

Doan, Theresa T. (Department: 2814)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S692000

Reexamination Certificate

active

07393759

ABSTRACT:
In a semiconductor substrate having a notch in an edge portion thereof, each of the two shoulder portions of the notch is configured as an arc and the difference in curvature between the two shoulder portions of the notch is not less than 0 mm and not more than 0.1 mm.

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Japanese Office Action issued in Japanese Patent Application No. JP 2003-427402, dated Apr. 10, 2007.

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