Semiconductor substrate damage protection system

Details Semiconductor substrate damage protection system Semiconductor substrate damage protection system

2007-04-17

2007-04-17

Keenan, James W. (Department: 3652)

Material or article handling

Process

Reexamination Certificate

active

10198688

ABSTRACT:
A method and apparatus for preventing substrate damage in a factory interface. In one embodiment, a method for preventing substrate damage in a factory interface includes the steps of receiving an indicia of potential substrate damage, and automatically preventing substrates from moving out of a substrate storage cassette in response to the received indicia. The indicia may be a seismic warning signal, among others. In another embodiment, a method for preventing substrate damage in a factory interface includes the steps of moving a pod door in a first direction to a position spaced-apart and adjacent a pod, and moving the pod door laterally in a second direction to close the pod. The lateral closing motion of the pod door urges substrates, which may be misaligned in the pod, into a predefined position within the pod.

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PCT Invitation to Pay Additional Fees based on International Application No. PCT/US03/22367, dated Dec. 3, 2003.

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