Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-08-30
1997-10-07
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
134 12, 1566431, 1566381, H01L 21302
Patent
active
056743572
ABSTRACT:
A method for removing particulate residues from semiconductor substrates. A semiconductor substrate is provided which has upon its surface a particulate residue. At minimum, either the semiconductor substrate or the particulate residue is susceptible to oxidation upon exposure to an oxygen containing plasma. The semiconductor substrate and the particulate residue are exposed to an oxygen plasma. The particulates are then rinsed from the surface of the semiconductor substrate with deionized water.
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Chao Ying-Chen
Sun Yi-Lin
Ackerman Stephen B.
Breneman R. Bruce
Goudreau George
Saile George O.
Szecsy Alek P.
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