Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2008-01-16
2010-11-23
Dickey, Thomas L (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257SE33033, C257SE21508
Reexamination Certificate
active
07838954
ABSTRACT:
A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
REFERENCES:
patent: 6024275 (2000-02-01), Takiar
patent: 6281041 (2001-08-01), Ho
patent: 6348401 (2002-02-01), Chen
patent: 6893799 (2005-05-01), Danovitch
patent: 2004/0155358 (2004-08-01), Iijima
patent: 2007/0059548 (2007-03-01), Love
Suganuma et al. “Sn-Zn low temperature solder”, 2006, in Lead-Free Electronic Solders, a special issue of the Journal of Material Science: Materials in Electronics, pp. 121-127.
Chen et al., “Phase diagrams of Pb-free solders and their related materials systems”, 2006, in Lead-Free Electronic Solders, a special issue of the Journal of Material Science: Materials in Electronics, pp. 19-37.
Buchwalter Stephen L
Gruber Peter A
Nah Jae-Woong
Shih Da-Yuan
Dickey Thomas L
International Business Machines - Corporation
Nugent Theresa O'Rourke
Nugent & Smith LLP
Yushin Nikolay
LandOfFree
Semiconductor structure with solder bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor structure with solder bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structure with solder bumps will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4246529