4. Metal fusion bonding
  5. With control means responsive to sensed condition

Peter A Gruber

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Feed devices and methods for injection molded solder systems

Metal fusion bonding – With control means responsive to sensed condition
Reexamination Certificate

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Semiconductor structure with solder bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2963261

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