Semiconductor storage device and method for manufacturing...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257SE21659

Reexamination Certificate

active

08071449

ABSTRACT:
A semiconductor storage device has a plurality of word lines formed with a predetermined interval on a semiconductor substrate, a selection transistor provided at an end portion of the plurality of word lines, a first insulating film formed so as to cover side surfaces of the word lines, a side surface of the selection transistor, and a surface of the semiconductor substrate between the word lines, a high-permittivity film formed on the first insulation film, a second insulating film formed so as to cover the upper surface of the word lines and the selection transistor, a first air-gap portion located between the word lines and surrounded by the high-permittivity film and the second insulating film, and a second air-gap portion formed via the first insulating film and the high-permittivity film at a sidewall portion, which opposes the selection transistor, of the word line adjacent to the selection transistor, an upper portion of the second air-gap portion being covered by the second insulating film.

REFERENCES:
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Kang et al.; “The Air Spacer Technology for Improving the Cell Distribution in 1 Giga Bit NAND Flash Memory”; IEEE, pp. 36-37, (2006).
Notification of Reasons for Rejection issued by the Japanese Patent Office on Jul. 16, 2010, for Japanese Patent Application No. 2008-052185, and English-language translation thereof.

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