Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-05-13
2008-05-13
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S730000, C257S780000, C257S784000, C361S784000, C361S790000, C361S792000, C438S109000, C438S125000
Reexamination Certificate
active
07372141
ABSTRACT:
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. One or more additional components may be stacked over the land side of the first package substrate.
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Chow Seng Guan
Han Byung Joon
Karnezos Marcos
Ramakrishna Kambhampati
Shim Il Kwon
Chambliss Alonzo
Stats Chippac Ltd.
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