Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-08-23
2005-08-23
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S701000, C257S706000, C257S712000, C257S659000, C257S660000, C438S106000, C438S108000, C438S109000, C438S110000
Reexamination Certificate
active
06933598
ABSTRACT:
A semiconductor multi-package module has an inverted second package stacked over a first package, in which the stacked packages are electronically interconnected by wire bonds, and in which at least one of the packages is provided with an electrical shield. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die and having a shield, affixing an upper molded package including an upper substrate in inverted orientation onto an upper surface of the lower package, and forming z-interconnects between the upper and lower substrates. Where the shield is situated above the lower package substrate, the inverted upper package is affixed onto an upper surface of the shield.
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Bill Kennedy Haynes Beffel & Wolfeld LLP
ChipPAC, Inc.
Flynn Nathan J.
Forde Remmon R.
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