Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2008-05-14
2010-11-30
Kackar, Ram N. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345520, C118S728000, C118S725000, C361S234000, C279S128000
Reexamination Certificate
active
07842160
ABSTRACT:
A tubular electrode (215) and a tubular magnet (216) are installed on an external section of a processing furnace (202) for an MMT device. A susceptor (217) for holding a wafer (200) is installed inside a processing chamber (201) of the processing furnace. A gate valve (244) for conveying the wafer into and out of the processing chamber; and a shower head (236) for spraying processing gas in a shower onto the wafer, are installed inside the processing furnace. A high frequency electrode (2) and a heater (3) are installed inside the susceptor (217) with a clearance between them and the walls forming the space. The clearances formed between the walls forming the space in the susceptor and the high frequency electrode and the heater prevent damage to the high frequency electrode and the heater even if a thermal expansion differential occurs between the high frequency electrode, the heater and the susceptor.
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JP—08078193—Eng—Mar. 22, 1996.
Japanese Office Action dated Mar. 17, 2009, including an English-language translation.
Ishisaka Mitsunori
Kasanami Katsuhisa
Miyata Toshimitsu
Hitachi Kokusai Electric Inc.
Kackar Ram N.
Kratz Quintos & Hanson, LLP
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