Semiconductor processing spray coating apparatus

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438760, 427240, 4273722, 427421, 427422, 427425, H01L 214763, B05D 102, B05D 302, B05D 312

Patent

active

060665750

ABSTRACT:
A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

REFERENCES:
patent: 3148085 (1964-09-01), Wiegmann
patent: 3326717 (1967-06-01), Gregor et al.
patent: 3978578 (1976-09-01), Murphy
patent: 4222345 (1980-09-01), Bergfelt et al.
patent: 4267212 (1981-05-01), Sakawaki
patent: 4282825 (1981-08-01), Nagatomo et al.
patent: 4290384 (1981-09-01), Ausschnitt et al.
patent: 4416213 (1983-11-01), Sakiya
patent: 4457259 (1984-07-01), Samuels
patent: 4542038 (1985-09-01), Odaka et al.
patent: 4590094 (1986-05-01), Ringer, Jr.
patent: 4668334 (1987-05-01), Doornveld
patent: 4688918 (1987-08-01), Suzuki et al.
patent: 4709858 (1987-12-01), Stern et al.
patent: 4793282 (1988-12-01), Greenberg et al.
patent: 4830882 (1989-05-01), Ichinose et al.
patent: 4875824 (1989-10-01), Moe et al.
patent: 4895099 (1990-01-01), D'Amato
patent: 4924800 (1990-05-01), Tanaka
patent: 4932353 (1990-06-01), Kawata et al.
patent: 4987854 (1991-01-01), Hall
patent: 4996080 (1991-02-01), Daraktchiev
patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5056462 (1991-10-01), Perkins et al.
patent: 5065692 (1991-11-01), Hollesen et al.
patent: 5085560 (1992-02-01), Thompson et al.
patent: 5094884 (1992-03-01), Hillman et al.
patent: 5127362 (1992-07-01), Iwatsu et al.
patent: 5168886 (1992-12-01), Thompson et al.
patent: 5168887 (1992-12-01), Thompson et al.
patent: 5183508 (1993-02-01), Cholinski
patent: 5192087 (1993-03-01), Kawashima et al.
patent: 5224503 (1993-07-01), Thompson et al.
patent: 5232328 (1993-08-01), Owczarz et al.
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5252137 (1993-10-01), Tateyama et al.
patent: 5270248 (1993-12-01), Rosenblum et al.
patent: 5358740 (1994-10-01), Bornside et al.
patent: 5378511 (1995-01-01), Cardinali et al.
patent: 5395803 (1995-03-01), Adams
patent: 5403617 (1995-04-01), Haaland
patent: 5429912 (1995-07-01), Neoh
patent: 5431421 (1995-07-01), Thompson et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1989, "Upside-Down Resist Coating of Semiconductor Wafers".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor processing spray coating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor processing spray coating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor processing spray coating apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1836869

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.