Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1997-06-26
2000-05-23
Beck, Shrive
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438760, 427240, 4273722, 427421, 427422, 427425, H01L 214763, B05D 102, B05D 302, B05D 312
Patent
active
060665750
ABSTRACT:
A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.
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IBM Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1989, "Upside-Down Resist Coating of Semiconductor Wafers".
Meuchel Craig P.
Oberlitner Thomas H.
Reardon Timothy J.
Barr Michael
Beck Shrive
Semitool Inc.
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