Semiconductor processing method of forming field oxide regions o

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation

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438448, 438696, H01L 2176

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056292309

ABSTRACT:
A semiconductor processing method of forming a field oxide region on a semiconductor substrate includes, a) providing a patterned first masking layer over a desired active area region of a semiconductor substrate, the first masking layer having at least one side edge; b) providing a silicon sidewall spacer over the side edge of the patterned first masking layer, the silicon sidewall spacer having a laterally outward projecting foot portion; c) oxidizing the substrate and the silicon sidewall spacer to form a field oxide region on the substrate; d) stripping the first masking layer from the substrate; and e) providing a gate oxide layer over the substrate. The invention enables taking advantage of process techniques which minimize the size of field oxide bird's beaks without sacrificing upper field oxide topography.

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Park et al "A Novel Locos Type Isolation Technology Free of the Field Oxide Thinning Effect", Solid State Devices and Materials, pp. 528-530, 1993.

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