Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation
Patent
1995-08-01
1997-05-13
Trinh, Michael
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Recessed oxide by localized oxidation
438448, 438696, H01L 2176
Patent
active
056292309
ABSTRACT:
A semiconductor processing method of forming a field oxide region on a semiconductor substrate includes, a) providing a patterned first masking layer over a desired active area region of a semiconductor substrate, the first masking layer having at least one side edge; b) providing a silicon sidewall spacer over the side edge of the patterned first masking layer, the silicon sidewall spacer having a laterally outward projecting foot portion; c) oxidizing the substrate and the silicon sidewall spacer to form a field oxide region on the substrate; d) stripping the first masking layer from the substrate; and e) providing a gate oxide layer over the substrate. The invention enables taking advantage of process techniques which minimize the size of field oxide bird's beaks without sacrificing upper field oxide topography.
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Dickerson David L.
Fazan Pierre C.
Jeng Nanseng
Micro)n Technology, Inc.
Trinh Michael
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