Semiconductor processing chamber substrate holder method and...

Details Semiconductor processing chamber substrate holder method and... Semiconductor processing chamber substrate holder method and...

2005-03-08

2005-03-08

Reichard, Dean A. (Department: 2831)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

C361S233000, C361S749000, C361S750000, C438S457000

Reexamination Certificate

active

06865065

ABSTRACT:
A method and system for processing wafers is disclosed. According to one embodiment (100) a chuck system (102) may be situated opposite to an input source (104). A chuck system (102) may apply a force (e.g., mechanical and/or electromagnetic) that deforms a substrate (108). Once deformed, essentially all of a substrate (108) may be oriented at a predetermined angle (e.g., 90°) with respect to an input source (104).

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patent: 5793192 (1998-08-01), Kubly et al.
patent: 6141203 (2000-10-01), Sherman
patent: 6156623 (2000-12-01), Hendrix et al.

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