Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-09-27
2008-10-28
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S758000, C438S770000, C257SE29141, C324S754090, C324S762010
Reexamination Certificate
active
07442571
ABSTRACT:
Provided are a semiconductor probe having a resistive tip, a method of fabricating the semiconductor probe, and a method of recording and reproducing information using the semiconductor probe. The semiconductor probe includes a tip and a cantilever. The tip is doped with first impurities. The cantilever has an end portion on which the tip is positioned. The tip includes a resistive area, and first and second semiconductor electrode areas. The resistive area is positioned at the peak of the tip and lightly doped with second impurities that are different from the first impurities. The first and second semiconductor electrode areas are heavily doped with the second impurities and contact the resistive area.
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Jung Ju-Hwan
Park Hong-Sik
Shin Hyun-Jung
Lindsay, Jr. Walter
Mustapha Abdulfattah
Samsung Electronics Co,. Ltd.
Sughrue & Mion, PLLC
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