Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Inventor
active
Molded leadless package having a partially exposed lead...
Molded leadless package having a partially exposed lead...
Power device package comprising metal tab die attach paddle...
Power module package having improved heat dissipating...
Power module package having improved heat dissipating...
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Profile ID: LFUS-PAI-P-2406164