4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Li Yunfang

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Quad flat no-lead (QFN) chip package assembly apparatus and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor power device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3133460

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