Semiconductor packages and methods of manufacturing thereof

Details Semiconductor packages and methods of manufacturing thereof Semiconductor packages and methods of manufacturing thereof

2006-08-24

2008-03-25

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000

Reexamination Certificate

active

07348218

ABSTRACT:
Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active surface and a coupling surface opposite the active surface, where the chip has one or more integrated circuits and bumps. The device also includes a thermal spreader thermally coupled to the coupling surface of the chip for dissipating heat generated by the chip, and a thermal interface material located between the thermal spreader and the coupling surface of the chip for improving the heat dissipation. In addition, the device also includes a boundary material located between the thermal spreader and the coupling surface of the chip, where the boundary material is configured to surround a perimeter of the thermal interface material to maintain the thermal interface material between the thermal spreader and the coupling surface of the chip.

REFERENCES:
patent: 6118177 (2000-09-01), Lischner et al.
patent: 6285078 (2001-09-01), Nelson
patent: 6756668 (2004-06-01), Baek et al.
patent: 6891259 (2005-05-01), Im et al.

Affiliated with

Also associated with

Rating

Semiconductor packages and methods of manufacturing thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor packages and methods of manufacturing thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor packages and methods of manufacturing thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3979807