4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Non-single crystal, or recrystallized, semiconductor...
  6. Amorphous semiconductor material

Tsorng-Dih Yuan

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Bonded wafer structure having a buried insulation layer

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
Patent

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Bonded wafer structure having a buried insulation layer

Fishing – trapping – and vermin destroying
Patent

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Chip packaging system and method using deposited diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip packaging system and method using deposited diamond film

Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate

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Cooling device with multiple compliant elements

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-516608

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