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2011-06-07

2011-06-07

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S669000

Reexamination Certificate

active

07955884

ABSTRACT:
A semiconductor package includes a semiconductor chip including a semiconductor substrate and a plurality of cell transistors arranged on the semiconductor substrate. Channel regions of the cell transistors have channel lengths that extend in a first direction, and the package further includes a supporting substrate having an upper surface on which the semiconductor chip is affixed. The supporting substrate is configured to bend in response to a temperature increase in a manner that applies a tensile stress to the channel regions of the semiconductor chip in the first direction. Related methods are also disclosed.

REFERENCES:
patent: 6121689 (2000-09-01), Capote et al.
patent: 6633078 (2003-10-01), Hamaguchi et al.
patent: 6717216 (2004-04-01), Doris et al.
patent: 2006-245408 (2006-09-01), None

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