Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-02-28
2006-02-28
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C257S724000, C257S676000
Reexamination Certificate
active
07005325
ABSTRACT:
A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
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patent: 5804880 (1998-09-01), Mathew
patent: 6486535 (2002-11-01), Liu
patent: 6696952 (2004-02-01), Zirbes
patent: 2002/0195693 (2002-12-01), Liu et al.
Ahn Byung Hoon
Chow Seng Guan
Shim Il Kwon
Ying Ming
Ishimaru Mikio
Parekh Nitin
St Assembly Test Services Ltd.
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