Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2005-03-29
2005-03-29
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S782000
Reexamination Certificate
active
06873059
ABSTRACT:
A semiconductor device comprising a semiconductor chip having an active and a passive surface, the passive surface adhesively attached to a substrate film by means of a multilayer composite; this composite comprising a metal foil having first and second surfaces and an adhesive layer attached on each of these surfaces. The multilayer composite has an average modulus larger than the modulus of the encapsulating molding compound used in the semiconductor device. By applying the composite to assembling face-up chip-scale devices, stress in solder joints is reduced and solder fatigue life enhanced.
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patent: 6166433 (2000-12-01), Takashima et al.
patent: 6333466 (2001-12-01), Miyaake et al.
patent: 6376769 (2002-04-01), Chung
patent: 0751 561 (1997-01-01), None
patent: WO 99 18609 (1999-04-01), None
patent: WO 00 78887 (2002-05-01), None
Lamtec® Corporation; ARENASHIELD Foil/Fiberglass-Polyester Blend Fabric.
Lamtec® Corporation; GYMGUARD Polypropylene/Fiberglass-Polyester Blend Fabric.
STANDARD Suspension Fabric, “NEW” Std. Fabric for 2002, Simple Saver System®.
Purlin Glide™Vapor Retarder Standard Duty (.02 Perm).
Amagai Masazumi
Karashima Akira
Brady III W. James
Le Dung A.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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