4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Masazumi Amagai

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active

Assembly of semiconductor device and wiring substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Direct attachment of semiconductor chip to organic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Direct attachment semiconductor chip to organic substrate

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Lead over chip semiconductor device including a heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Lead-free solder

Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
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Profile ID: LFUS-PAI-P-212266

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