Semiconductor package using flip-chip mounting technique

Details Semiconductor package using flip-chip mounting technique Semiconductor package using flip-chip mounting technique

2007-06-05

2007-06-05

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S783000, C257S786000

Reexamination Certificate

active

11245413

ABSTRACT:
A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

REFERENCES:
patent: 6064120 (2000-05-01), Cobbley et al.
patent: 6878435 (2005-04-01), Paik et al.
patent: 10-039314 (2001-01-01), None

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