4. Equipment for preparing or serving food or drink not elsewhere s
  5. Warming or cooking
  6. Vessel, e.g., cooking container, pan, etc.

Chang Su Park

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Optical modulator module package using flip-chip mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Optical modulator module package using flip-chip mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Oval chafer unit

Compound tools – Cutter combined with other tool or tools
Design Patent

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Round chafer unit

Equipment for preparing or serving food or drink not elsewhere s – Warming or cooking – Vessel – e.g. – cooking container – pan – etc.
Patent

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Semiconductor package using flip-chip mounting technique

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1580180

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